%PDF-1.6 % 111 0 obj <>/PageLayout/SinglePage/Pages 35 0 R/Type/Catalog/ViewerPreferences<>>> endobj 115 0 obj <>stream application/pdf Nokibul Islam, Vinayak Pandey, KyungOe Kim 2017 IEEE 67th Electronic Components and Technology Conference Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package 2017-04-28T14:37:07-07:00 2017-06-14T16:26:12-06:00 2017-06-14T16:26:12-06:00 flip chip, fine pitch, Cu pillar, BOL, fcBGA iTextSharp 4.0.7 (based on iText 2.0.7) uuid:509873f7-0a3b-423d-83fe-69aa79b67e78 uuid:a5cc8837-8a5c-4f3c-a7c4-c70112eb08ca endstream endobj 35 0 obj <> endobj 116 0 obj <> endobj 21 0 obj <>/Font<>/ProcSet[/PDF/Text/ImageB/ImageC/ImageI]/XObject<>>>/Rotate 0/Thumb 22 0 R/Type/Page>> endobj 50 0 obj <>/ExtGState<>/Font<>/Pattern<>/ProcSet[/PDF/Text/ImageB/ImageC/ImageI]/XObject<>>>/Rotate 0/Thumb 55 0 R/Type/Page>> endobj 51 0 obj <>/Font<>/ProcSet[/PDF/Text/ImageB/ImageC/ImageI]/XObject<>>>/Rotate 0/Thumb 84 0 R/Type/Page>> endobj 52 0 obj <>/Font<>/ProcSet[/PDF/Text/ImageB/ImageC/ImageI]/XObject<>>>/Rotate 0/Thumb 92 0 R/Type/Page>> endobj 53 0 obj <>/Font<>/ProcSet[/PDF/Text/ImageB/ImageC/ImageI]/XObject<>>>/Rotate 0/Thumb 106 0 R/Type/Page>> endobj 54 0 obj <>/Font<>/ProcSet[/PDF/Text/ImageB/ImageC/ImageI]/XObject<>>>/Rotate 0/Thumb 109 0 R/Type/Page>> endobj 109 0 obj <>stream HW???ukgAЫ?s;kϕ?X?[?4~?5xN?| i?dAm?Th nM?! l?`A?GbS?ahV$1`ٽg?x 国产精品99无码一区二区