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As the electronics industry moves towards more complex semiconductor packages that are smaller, faster, and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long-term reliability issues or stress on a package. Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation.

JCET’s worldwide package characterization teams located in China, Singapore, South Korea, and the United States provide advanced package characterization services for our global customers to ensure they have high quality, high performance, reliable, and cost-effective package designs that meet their market requirements.

Key Features

CET collaborates with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost. JCET’s full-service package Design Centers help customers determine the optimum package for their specific end product.

Design Services

Customer-centric designers

Mobile design capability

State-of-the-art design tools

Integration of customer-supplied designs

Project data management

Characterization Services

Thermal Analysis TEST

Mold Flow Analysis

Mechanical Analysis

Electrical Analysis

JCET Design Services

  • Proven Experience

    Proven Experience

    JCET’s world class design team has extensive experienced in the mobile, networking, computing, consumer, and automotive markets. Their experience covers a wide range of Laminate, leadframe, and wafer-level package designs, including single die, multi-die, Package-on-Package (PoP), Integrated Passive Devices (IPD), and advanced System-in-Package (SiP). JCET’s dedicated design team has the necessary experience to provide complex designs that meet or exceed assembly and cost targets.

  • Design for Performance

    Design for Performance

    Today's package designs adhere to stringent thermal and electrical requirements while providing high-end performance for our customer's end products. To ensure a semiconductor package meets performance requirements, JCET’s Design and Characterization Team works closely with the customer through co-design while the integrated circuit (IC) is in development. The “Co-Design” of a package provides the best environment for optimum performance. JCET’s package designs meet our customers’ needs whether as a single chip device or complex System-in-Package (SiP).

  • Design Process

    Design Process

    JCET manages the design process using our Product Data Management system. From the moment a request enters our system the design team works with our characterization experts and our customers to understand their needs for each design. As each new design is received, it undergoes feasibility to determine if the package will meet the requirements of our factories, suppliers, and customers. Our designers collaborate with customers to ensure the optimum package is produced with consideration to cost, assembly and function.

  • Design Tool Sets

    Design Tool Sets

    • Cadence: SiP and APD
    • AutoDesk: AutoCad
    • Downstream: CAM350
    • Internally developed support tools

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